Prof. Changwen Chen is currently Chair Professor of Visual Computing at The Hong Kong Polytechnic University. Previously, he has been an Empire Innovation Professor of Computer Science and Engineering at the University at Buffalo, State University of New York from 2008 to 2021. He also served as Dean of the School of Science and Engineering at The Chinese University of Hong Kong, Shenzhen from 2017 to 2020. He was Allen Henry Endow Chair Professor at the Florida Institute of Technology from 2003 to 2007. He was on the faculty of Electrical and Computer Engineering at the University of Missouri-Columbia from 1996 to 2003 and on the faculty of Electrical and Computer Engineering at the University of Rochester from 1992 to 1996.

Prof. Chen has been the Editor-in-Chief for IEEE Transactions on Multimedia from January 2014 to December 2016. He has also served as the Editor-in-Chief for IEEE Transactions on Circuits and Systems for Video Technology from January 2006 to December 2009. Currently, he is the Associate Editor-in-Chief of IEEE Transactions on Biometrics, Behavior, and Identity Science. He has been an Editor for several other major IEEE Transactions and Journals, including the Proceedings of IEEE, IEEE Journal of Selected Areas in Communications, and IEEE Journal of Emerging and Selected Topics in Circuits and Systems. He has served as Conference Chair for several major IEEE, ACM and SPIE conferences related to multimedia video communications and signal processing. His research has been supported by NSF, DARPA, Air Force, NASA, Whitaker Foundation, Microsoft, Intel, Kodak, Huawei, and Technicolor.

Prof. Chen received his BS degree from University of Science and Technology of China in 1983, MSEE degree from University of Southern California in 1986, and Ph.D. degree from University of Illinois at Urbana-Champaign in 1992. He and his students have received nine Best Paper Awards or Best Student Paper Awards. He has also received several research and professional achievement awards, including Sigma Xi Excellence in Graduate Research Mentoring Award in 2003, Alexander von Humboldt Research Award in 2009, the University at Buffalo Exceptional Scholar - Sustained Achievement Award in 2012, the State University of New York System Chancellor’s Award for Excellence in Scholarship and Creative Activities in 2016, and the Distinguished ECE Alumni Award from University of Illinois at Urbana-Champaign in 2019. He is an IEEE Fellow since 2004, an SPIE Fellow since 2007 and a member of Academia Europaea since 2021.